Printed circuit board and method of manufacturing same
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United States of America Patent
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Oct 10, 2017
Grant Date -
Oct 1, 2015
app pub date -
Jun 11, 2015
filing date -
Dec 14, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board has a core made of an aluminum material; a bonding member positioned on opposite surfaces of the core; a base layer bonded to the opposite surface of the core through the bonding member; a receiving hole extending through the core, the bonding member, and the base layer; a zinc substitution layer positioned on a surface of the base layer and a portion of the base layer exposed on an inner surface of the receiving hole; and a plating layer positioned on the zinc substitution layer, and having a circuit pattern.
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