Light emitting diode package substrate and light emitting diode package element
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 10, 2017
Grant Date -
N/A
app pub date -
Aug 31, 2016
filing date -
May 30, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A miniaturized LED package substrate allowing for the better installation of an electrostatic protection device includes an upper substrate, a lower substrate, and a circuit layer. The circuit layer is positioned between the upper substrate and the lower substrate and electrically connected to the upper substrate and the lower substrate. At least one cavity is defined at the lower substrate, and each of the at least one cavity passes through the lower substrate to expose a portion of the circuit layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully