Dual-side reinforcement flux for encapsulation

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United States of America Patent

PATENT NO 9786629
APP PUB NO 20160163672A1
SERIAL NO

14908986

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Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.

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CITIBANK N A388 GREENWICH STREET NEW YORK NY 10013

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mukherjee, Sutapa Bangalore, IN 15 63
Raut, Rahul Edison, US 21 50
Ribas, Morgana De Avila Bangalore, IN 4 8
Sarkar, Siuli Bangalore, IN 53 164
Siddappa, Harish Hanchina Bangalore, IN 2 4
Singh, Bawa Marlton, US 108 1502
Venkatagiriyappa, Ramakrishna Hosur Bangalore, IN 2 4

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