Method for manufacturing package structure
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United States of America Patent
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Oct 10, 2017
Issued Date -
N/A
app pub date -
Sep 17, 2015
filing date -
Dec 19, 2014
priority date (Note) -
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Abstract
A method for manufacturing a package structure carries out in following way. A flexible circuit board is provided. The flexible circuit board defines a bent area and a laminated area. The flexible circuit board includes a first dielectric layer, a first conductive pattern and a bearing layer located at opposite sides. The bearing layer corresponds to the laminated area. A second dielectric layer and a second conductive pattern are formed on the first conductive pattern. A third dielectric layer and a third conductive pattern are formed on the bearing layer. All of the second and third dielectric layers, and the second and third conductive pattern corresponds to the laminated area. A first solder resist layer is formed on the second conductive layer. The first solder resist layer defines a plurality of openings, a portion of the second conductive pattern is exposed from the openings defining a plurality of first pads.
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