Method for coating cavities of semiconductor substrates
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United States of America Patent
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Oct 10, 2017
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app pub date -
Jan 9, 2015
filing date -
Mar 26, 2014
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Abstract
A method for temporary coating of cavities, which at least partially run through a semiconductor substrate and are provided for a permanent coating and/or equipping, with a temporarily applied coating material before processing steps for processing at least one surface of the semiconductor substrate. In addition, a method for removing a temporary coating of cavities of a semiconductor substrate, whereby the coating is applied according to a previously-mentioned method and whereby, in particular immediately afterwards, a permanent coating and/or equipping of the cavities is carried out.
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