Heat insulator
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United States of America Patent
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Oct 10, 2017
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Jun 30, 2015
filing date -
Jul 2, 2014
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Abstract
One aspect of the heat insulator of the present invention includes a porous sintered body having a porosity of 70 vol % or more and less than 91 vol %, and pores having a pore size of 0.8 μm or more and less than 10 μm occupy 10 vol % or more and 70 vol % or less of the total pore volume, while pores having a pore size of 0.01 μm or more and less than 0.8 μm occupy 5 vol % or more and 30 vol % or less of the total pore volume. The porous sintered body is formed from an MgAl2O4 (spinel) raw material and fibers formed of an inorganic material, the heat conductivity of the heat insulator at 1000° C. or more and 1500° C. or less is 0.40 W/(m·K) or less, and the weight ratio of Si relative to Mg in the porous sintered body is 0.15 or less.
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