Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom

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United States of America Patent

PATENT NO 9783882
APP PUB NO 20150034477A1
SERIAL NO

14482251

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Abstract

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In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and rejuvenated by, e.g., cold spray, is utilized in sputtering processes to produce metallic thin films.

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Patent Owner(s)

Patent OwnerAddress
MATERION NEWTON INC45 INDUSTRIAL PLACE NEWTON MA 02451

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kumar, Prabhat Framingham, US 94 1335
Miller, Steven A Canton, US 86 1526
Schmidt-Park, Olaf Needham, US 11 170
Sun, Shuwei Framingham, US 27 228
Wu, Richard North Chelmsford, US 44 546
Zimmermann, Stefan Bad Saeckingen, DE 59 707

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