Soldering apparatus with automatic aligning function
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United States of America Patent
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Oct 3, 2017
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N/A
app pub date -
Mar 27, 2015
filing date -
Mar 27, 2015
priority date (Note) -
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Abstract
A soldering apparatus includes a reflow oven, a transmission mechanism, and a controlling unit. The reflow oven includes an inlet and an output mechanism. The output mechanism includes two guide rails and two link belts. An end of a first guide rail has a first alignment structure. The two link belts are movably disposed on the guide rails for outputting a printed wiring board. A distance between the guide rails is previously adjusted to be equal to a width of the printed wiring board. The transmission mechanism includes two tracks and two conveyor belts. An end of a first track has a second alignment structure. The two conveyor belts are movably disposed on the two tracks for transporting the printed wiring board. The controlling unit controls a movement of the first track, so that the first alignment structure and the second alignment structure are automatically aligned with each other.
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