Molded interconnect mircoelectromechanical system (MEMS) device package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 3, 2017
Issued Date -
N/A
app pub date -
Apr 14, 2016
filing date -
Oct 29, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectromechanical system (MEMS) device package for encapsulating a MEMS device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the MEMS device package and is adapted to route electrical connections from the MEMS device to either the substrate or a second MEMS device package via the substrate.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully