Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
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United States of America Patent
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Oct 3, 2017
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app pub date -
Mar 15, 2017
filing date -
Feb 18, 2016
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Abstract
An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.
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