Solder ball, manufacturing method thereof, and semiconductor device

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United States of America Patent

PATENT NO 9780056
SERIAL NO

15297158

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Abstract

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A solder ball includes a silver ball structure and a shell structure. The shell structure wraps a surface of the silver ball structure, and a material of the shell structure at least includes tin. When the solder ball is bonded to other devices, the ball height of the solder ball remains constant to avoid collapse.

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Patent Owner(s)

Patent OwnerAddress
CHIPMOS TECHNOLOGIES INCHSINCHU

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsu, Tzu-Han Hsinchu, TW 12 48
Lu, Tung-Bao Hsinchu, TW 3 1

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