Method for making EMI shielding layer on a package
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United States of America Patent
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Oct 3, 2017
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N/A
app pub date -
Sep 13, 2016
filing date -
May 25, 2016
priority date (Note) -
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Abstract
A method for making EMI shielding layer on a package is disclosed to include the steps of: a) disposing a UV curable adhesive which can be thermally released on a light-transmissive substrate; b) placing the package on the UV curable adhesive in such a way that the UV curable adhesive adheres to and cover a surface of the package having solder pads; c) irradiating UV light toward the light-transmissive substrate to cure the UV curable adhesive; d) forming an EMI shielding layer on the package; and e) thermally releasing the UV curable adhesive.
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