Apparatus for liquid treatment of wafer shaped articles

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9779979
APP PUB NO 20150243543A1
SERIAL NO

14188230

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus for processing wafer-shaped articles comprises a spin chuck adapted to hold and spin a wafer-shaped article of a predetermined diameter during a processing operation. A liquid collector surrounds the spin chuck, and comprises a first inner surface. The first inner surface comprises a first conductive material. The collector further comprises a first conductive pathway for grounding the first conductive material.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH AGSEZ-STRASSE 1 9500 VILLACH 9500

International Classification(s)

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  • 2014 Application Filing Year
  • H01L Class
  • 23828 Applications Filed
  • 21803 Patents Issued To-Date
  • 91.51 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2014201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pliska, Milan Villach, AT 6 16
Schwarzenbacher, Reinhold Reisseck, AT 9 21

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Patent Citation Ranking

  • 2 Citation Count
  • H01L Class
  • 18.50 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges26979357140748325312788503629173801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000950010000

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