Systems and methods for bonding semiconductor elements
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United States of America Patent
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Oct 3, 2017
Grant Date -
Jun 29, 2017
app pub date -
Mar 13, 2017
filing date -
Oct 8, 2013
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Abstract
A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures. A bonding surface of at least one of the first conductive structures and the second conductive structures includes a frangible coating.
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