Insulating thermally conductive resin composition
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United States of America Patent
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Oct 3, 2017
Grant Date -
Feb 11, 2016
app pub date -
Mar 3, 2014
filing date -
Mar 28, 2013
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Abstract
An insulating thermally conductive resin composition (1) includes a phase-separated structure including: a first resin phase (2) in which a first resin continues three-dimensionally; and a second resin phase (3) different from the first resin phase and formed of a second resin. Moreover, the insulating thermally conductive resin composition includes: small-diameter inorganic filler (4) unevenly distributed in the first resin phase; and large-diameter inorganic filler (5) that spans the first resin phase and the second resin phase and thermally connects pieces of the small-diameter inorganic filler, which is unevenly distributed in the first resin phase, to one another. Then, an average particle diameter of the small-diameter inorganic filler is 0.1 to 15 μm. Moreover, an average particle diameter of the large-diameter inorganic filler is larger than the average particle diameter of the small-diameter inorganic filler, and is 1 to 100 μm.
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