Electronic device having heat dissipation structure
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United States of America Patent
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Oct 3, 2017
Grant Date -
Oct 27, 2016
app pub date -
Apr 1, 2016
filing date -
Apr 22, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is an electronic device that includes: a housing that includes a metallic member; a battery pack that is disposed in the housing; a substrate that is disposed in parallel with the battery pack and includes at least one heat generating source; a heat dissipation plate that is disposed to overlap with at least a portion of the battery pack and the substrate, and is formed of a metallic material. Heat generated from the heat generating source may be dissipated to the battery pack through the heat dissipation plate. The electronic device includes an efficient heat dissipation structure that also contributes to the rigidity reinforcement and slimming of the electronic device, and can prevent an electric shock accident beforehand, which may be caused by an exterior of a metallic member. Other various embodiments may be made.
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