Defect inspection device and defect inspection method

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United States of America Patent

PATENT NO 9778206
SERIAL NO

14764985

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Abstract

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In an defect inspection method and device, in order to detect a minute defect present on a surface of a sample with a high degree of sensitivity, a defect inspection method includes imaging the same region of a sample in a plurality of image acquisition conditions and acquiring a plurality of images, processing the plurality of acquired images and extracting a defect candidate, clipping a partial image including the extracted defect candidate and a neighboring image of the defect candidate from the acquired images based on position information of the extracted defect candidate, obtaining feature quantities of the defect candidates in the plurality of clipped partial images, associating the defect candidates that have the same coordinates on the sample and are detected in different image acquisition condition, extracting a defect from among the associated defect candidates in a multi-dimensional feature quantity space, and outputting information of the extracted defect.

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH-TECH CORPORATION17-1 TORANOMON 1-CHOME MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Honda, Toshifumi Tokyo, JP 130 1458
Nishiyama, Hidetoshi Tokyo, JP 131 2044
Urano, Takahiro Tokyo, JP 16 148

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