Chemical mechanical polishing pad and method of making same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9776300
APP PUB NO 20160379840A1
SERIAL NO

15163152

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Abstract

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A chemical mechanical polishing pad is provided, comprising: a chemical mechanical polishing layer having a polishing surface; wherein the chemical mechanical polishing layer is formed by combining (a) a poly side (P) liquid component, comprising: an amine-carbon dioxide adduct; and, at least one of a polyol, a polyamine and a alcohol amine; and (b) an iso side (I) liquid component, comprising: polyfunctional isocyanate; wherein the chemical mechanical polishing layer has a porosity of ≧10 vol %; wherein the chemical mechanical polishing layer has a Shore D hardness of <40; and, wherein the polishing surface is adapted for polishing a substrate. Methods of making and using the same are also provided.

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Patent Owner(s)

Patent OwnerAddress
DOW GLOBAL TECHNOLOGIES LLC2040 DOW CENTER MIDLAND MI 48674
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC451 BELLEVUE ROAD NEWARK DE 19713

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brugarolas, Brufau Teresa Philadelphia, US 15 48
DeGroot, Marty W Middletown, US 48 385
Jacob, George C Newark, US 34 105
Kozhukh, Julia Bear, US 23 60
Lugo, Diego Newark, US 8 43
Miller, Jeffrey B West Chester, US 29 180
Qian, Bainian Newark, US 54 363
Stack, Marc R Middletown, US 6 30
Tong, Yuhua Hockessin, US 150 635
Tran, Tony Quan Bear, US 14 49
Veneziale, David Michael Hatfield, US 7 34
Wank, Andrew Avondale, US 14 39
Yeh, Fengji Wilmington, US 19 122

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