Desoldering tool nozzle and method of manufacturing the nozzle

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United States of America Patent

PATENT NO 9776271
SERIAL NO

14943933

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Abstract

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The object of the invention is to provide a nozzle for a desoldering tool that facilitates the removal of solder from components having a large difference between the width and thickness dimensions of the solder connection. The present application discloses a nozzle for use with a desoldering tool for melting and sucking solder away. The nozzle includes a distal end surface which is heated to a temperature melting the solder. The distal end surface, as an upstream end of a molten solder suction path, defines a non-circular elongated generally oval shaped opening.

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Patent Owner(s)

Patent OwnerAddress
HAKKO CORPORATION4-5 SHIOKUSA 2-CHOME NANIWA-KU OSAKA CITY OSAKA 556-0024

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mochizuki, Toshikazu Osaka, JP 22 217

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