Apparatuses and methods for transferring and bonding substrates
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United States of America Patent
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Oct 3, 2017
Grant Date -
Aug 4, 2016
app pub date -
Jan 25, 2016
filing date -
Feb 4, 2015
priority date (Note) -
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Abstract
A method for mechanically deforming a substrate assembly. The substrate assembly may advance at a first velocity toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and include a support surface between a first member and a second member. The first and second members may rotate at the first velocity and may be separated by an initial angle. The first member may receive a leading portion and the second member may receive a trailing portion of the substrate assembly. The first member may decelerate to a second velocity, and, subsequently, the second member may decelerate to the second velocity. The first member and the second member may be separated by a process angle, which may be different than the initial angle. A central portion of the substrate assembly may be relaxed while the leading and trailing portion may be held at a process tension. The substrate assembly may then undergo one or more processes.
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