Pad-array structure on substrate for mounting IC chip on substrate, and optical module having said pad-array structure

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United States of America Patent

PATENT NO 9775245
SERIAL NO

15128904

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Abstract

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A pad-array arrangement structure on a substrate for mounting an IC chip on the substrate, wherein a structure with which it is possible to maximally avoid an increase in the number of wiring layers on the substrate is obtained by devising the pad arrangement in an IC pad-array region.

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Patent Owner(s)

Patent OwnerAddress
PHOTONICS ELECTRONICS TECHNOLOGY RESEARCH ASOCIATION1-20-10 SEKIGUCHI BUNKYO-KU TOKYO 112-0014

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akagawa, Takeshi Tokyo, JP 28 65
Yashiki, Kenichiro Tokyo, JP 11 56

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