LOW-PROFILE ELECTRONIC APPARATUS AND METHODS
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United States of America Patent
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N/A
Issued Date -
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app pub date -
Mar 23, 2016
filing date -
Mar 23, 2016
priority date (Note) -
Granted
status (Latency Note)
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Abstract
Low-profile electronic component apparatus and methods of manufacturing and utilizing the same, for use with low-profile mobile devices and other applications. In one embodiment, the mobile device comprises a wireless-enabled smartphone, tablet, or laptop computer, and the component comprises an audio speaker which is recessed into a metallic support element, the latter recessed into the mobile device outer housing. The support element is coated with an insulating material, and conductive traces formed thereon for electrical interface with the contacts of the speaker. When assembled, the installation results in a substantially reduced overall vertical profile, thereby both potentially reducing the overall required thickness of the host device, and creating additional volume within the device housing (such as for other components, and/or enhanced audio response of the speaker) resulting in an additional spacing between the speaker component and any extant antenna assemblies.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
PULSE FINLAND OY | ORENZARO FINLAND |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Antila, Kimmo | Kiviniemi, FI | 6 | 291 |
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