Method for producing metal thin film and conductive structure
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United States of America Patent
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Sep 26, 2017
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app pub date -
Sep 11, 2014
filing date -
Dec 3, 2013
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Abstract
The metal thin film production method of the present invention includes, in the following order, the steps of: preparing a substrate (1) having thereon an underlayer (2) formed of an insulating resin; subjecting a surface of the underlayer (2) to a physical surface treatment for breaking bonds of organic molecules constituting the insulating resin; subjecting the substrate (1) to a heat treatment at a temperature of 200° C. or lower; applying a metal nanoparticle ink to the underlayer (2); and sintering metal nanoparticles contained in the metal nanoparticle ink at a temperature equal to or higher than a glass transition temperature of the underlayer (2). A fused layer (4) having a thickness of 100 nm or less is formed between the underlayer (2) and a metal thin film (3) formed by sintering the metal nanoparticles.
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