Semiconductor package with partial plating on contact side surfaces
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 26, 2017
Grant Date -
N/A
app pub date -
May 7, 2015
filing date -
May 7, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Embodiments of the present invention are directed to a semiconductor package with partial plating on contact surfaces. The semiconductor package includes a top surface, a bottom surface that is opposite the top surface, and side surfaces between the top surface and the bottom surface. Each of the side surfaces includes a step such that the area of the bottom surface is smaller than the area of the top surface. The semiconductor package includes a plurality of contacts that is located at peripheral edges of the bottom surface. Each of the plurality of contacts includes a first surface that is flush with the bottom surface, a second surface that is flush with one of the side surfaces, and a curved surface located at a corresponding step. In some embodiments, the first surface and the curved surface are plated, while the second surface is exposed (not plated).
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully