Semiconductor packages and methods of fabrication thereof
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United States of America Patent
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Sep 26, 2017
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app pub date -
Nov 26, 2012
filing date -
Nov 26, 2012
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Abstract
In accordance with an embodiment of the present invention, a semiconductor device includes a semiconductor chip having a first side and an opposite second side, and a chip contact pad disposed on the first side of the semiconductor chip. A dielectric liner is disposed over the semiconductor chip. The dielectric liner includes a plurality of openings over the chip contact pad. A interconnect contacts the semiconductor chip through the plurality of openings at the chip contact pad.
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