Method of manufacturing fan out wafer level package
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United States of America Patent
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Sep 26, 2017
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app pub date -
Oct 29, 2015
filing date -
Jan 27, 2015
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Abstract
A method of manufacturing a fan out wafer level package comprises: preparing conductive projections on an upper surface of a chip; mounting the chip on a carrier with the upper surface of the chip facing upwards; plastic packaging the chip to form a plastic packaging body with tops of the conductive projections being disposed outside the plastic package body; and implementing a redistribution line processing on the plastic package body. With this method, chips can be made small and thin and the manufacturing processes can be simplified.
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