Atomic layer or cyclic plasma etching chemistries and processes

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United States of America Patent

PATENT NO 9773683
APP PUB NO 20150270140A1
SERIAL NO

14730917

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Abstract

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Atomic layer or cyclic plasma etching chemistries and processes to etch films are disclosed. Films include Si, Ti, Ta, W, Al, Pd, Ir, Co, Fe, B, Cu, Ni, Pt, Ru, Mn, Mg, Cr, Au, alloys thereof, oxides thereof, nitrides thereof, and combinations thereof.

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Patent Owner(s)

Patent OwnerAddress
AMERICAN AIR LIQUIDE INC46409 LANDING PARKWAY FREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gupta, Rahul Newark, US 252 4566
Jurcik,, Jr Benjamin J Landenberg, US 9 670
Pallem, Venkateswara R Hockessin, US 52 2166

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