Folding type capacitor comprising through hole
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 26, 2017
Issued Date -
N/A
app pub date -
Aug 13, 2015
filing date -
Aug 18, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A folding type capacitor includes a metal substrate wherein a through hole penetrates an inside thereof; at least one dielectric layer formed on a surface of the metal substrate and an inner peripheral surface of the through hole; and an electrode layer formed on the at least one dielectric layer, wherein the metal substrate has bending portions whose surfaces are facing each other. Thus, manufacturing process is more simplified since Al2O3 insulation layers are formed by anodizing the aluminum layer without forming the extra dielectric layers after forming the aluminum layer, so that the manufacturing cost can be reduced, and also a multi-stacked capacitor having a high capacitance and a high reliability can be provided by stacking capacitors including a plurality of aluminum oxide layers using a more simplified process.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully