Family

Loading Family data...

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
MITSUBOSHI BELTING LTD	NO 1-21 4-CHOME HAMAZOE-DORI NAGATA-KU KOBE HYOGO

International Classification(s)

• C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
• H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
• C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Iseda, Taisuke	Hyogo, JP	15	21
Iwamoto, Masahiro	Hyogo, JP	44	451

Cited Art Landscape

Load Citation

• No Cited Art to Display

Loading Cited Art Landscape...

Patent Citation Ranking

Forward Cite Landscape

Load Citation

• No Forward Cites to Display

Loading Forward Cite Landscape...

Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Mar 26, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Mar 26, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 26, 2017	US,9773582,B2   US9773582B2	GRANTED PATENT AS SECOND PUBLICATION
September 03, 2015	US,20150247067,A1   US20150247067A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9773582

Conductive composition and conductive molded body

---

 

Legal Events