Cleaning formulation for removing residues on surfaces
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United States of America Patent
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Sep 26, 2017
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app pub date -
Dec 9, 2014
filing date -
Dec 11, 2013
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Abstract
This disclosure relates to a cleaning composition that contains 1) HF; 2) substituted or unsubstituted boric acid; 3) ammonium sulfate; 4) at least one metal corrosion inhibitor; 5) water; and 6) optionally, at least one pH adjusting agent, the pH adjusting agent being a base free of a metal ion. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
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