Halogen-free resin composition and use thereof
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United States of America Patent
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Sep 26, 2017
Grant Date -
Aug 25, 2016
app pub date -
Mar 21, 2014
filing date -
Feb 14, 2014
priority date (Note) -
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Abstract
The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SHENGYI TECHNOLOGY CO LTD | NO 5 GONGYE WEST ROAD SONGSHAN LAKE PARK DONGGUAN CITY GUANGDONG PROVINCE 523808 DONGGUAN CITY GUANGDONG PROVINCE 523808 |
International Classification(s)
- C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
He, Yueshan | Dongguan, CN | 15 | 36 |
Yang, Hu | Dongguan, CN | 82 | 646 |
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