Device and method for processing of wafers

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United States of America Patent

PATENT NO 9771223
SERIAL NO

13948478

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Abstract

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The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.

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Patent Owner(s)

  • EV GROUP GMBH

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hangweier, Peter Oliver Pram, AT 1 0
Lindner, Friedrich Paul Scharding, AT 45 91

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