Printed circuit board and manufacturing method therefor
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United States of America Patent
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Sep 19, 2017
Grant Date -
Sep 24, 2015
app pub date -
Jun 5, 2015
filing date -
Dec 7, 2012
priority date (Note) -
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Abstract
A printed circuit board has a double-sided substrate with an insulation layer, a bonding member, a base layer of an aluminum material, and a circuit pattern; a second insulation layer; a second bonding member; a second base layer; a through hole; a zinc substitution layer; a plating layer; and a second circuit pattern.
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