Method of producing a resist structure with undercut sidewall
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United States of America Patent
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Sep 19, 2017
Issued Date -
Jun 23, 2016
app pub date -
Jul 25, 2014
filing date -
Aug 6, 2013
priority date (Note) -
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Abstract
The method comprises the steps of applying a layer of a negative photoresist on a bottom layer, providing the layer of the negative photoresist with a pattern arranged in a border zone of the resist structure to be produced, irradiating a surface area of the layer of the negative photoresist according to the resist structure to be produced, and removing the layer of the negative photoresist outside the irradiated surface area. The pattern is produced in such a manner that it comprises a dimension that is smaller than a minimal resolution of the irradiation. The pattern may especially be designed as a sub-resolution assist feature.
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