Stacked rectifiers in a package

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United States of America Patent

PATENT NO 9761507
SERIAL NO

15092671

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Abstract

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A rectifier package is provided, which comprises a first rectifier die having an anode and a cathode conductively bonded to a first conductive film on a first surface. The rectifier package also comprises a second rectifier die having an anode and a cathode conductively bonded to the first conductive film on a second surface, which is opposite to the first surface. The first conductive film is in contact with both anodes or both cathodes of the first rectifier die and the second rectifier die.

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Patent Owner(s)

  • DIODES, INCORPORATED

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Tim C Plano, US 1 0
Huang, Bau Shun New Taipei, TW 1 0
Huang, Pin-Hao New Taipei, TW 11 0
Lin, Yeng-Liang Allen, US 1 0

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