Transceiver module, transceiver module receptacle assembly and transceiver module assembly

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United States of America Patent

PATENT NO 9759879
SERIAL NO

15154151

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Importance

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Abstract

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An electrode portion of a module board to be disposed in a transceiver module is formed from a group of contact pads which are arrayed substantially in parallel to a long side of the module board, and the group of contact pads include a line of ground line pads formed at predetermined intervals from one end to the other end, and two lines of signal line pads formed in spaces between the ground line pads.

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Patent Owner(s)

Patent OwnerAddress
YAMAICHI ELECTRONICS CO LTD2-16-2 MINAMIKAMATA OTA-KU TOKYO 144-8581

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ito, Toshiyasu Togane, JP 113 1529
Takai, Yosuke Sakura, JP 37 312

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