Electroplating methods for semiconductor substrates
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United States of America Patent
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Sep 12, 2017
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app pub date -
Mar 21, 2014
filing date -
Feb 7, 2014
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Abstract
A non-uniform initial metal film is non-uniformly deplated to provide a more uniform metal film on a substrate. Electrochemical deplating may be performed by placing the substrate in a deplating bath formulated specifically for deplating, rather than for plating. The deplating bath may have a throwing power of 0.3 or less; or a bath conductivity of 1 mS/cm to 250 mS/cm. Reverse electrical current conducted through the deplating bath non-uniformly. electro-etches or deplates the metal film.
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