Production method and device of surface roughened copper plate, and surface roughened copper plate

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United States of America Patent

PATENT NO 9758890
APP PUB NO 20140339094A1
SERIAL NO

14337264

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein.

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Patent Owner(s)

Patent OwnerAddress
FURUKAWA ELECTRIC CO LTD6-4 OTEMACHI 2-CHOME CHIYODA-KU TOKYO 1008322 JAPAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imai, Takahiro Shiga, JP 179 2278
Ishihama, Sadao Tokyo, JP 2 3
Oyoshi, Toshihiro Tokyo, JP 2 5
Watanabe, Hajime Shiga, JP 114 744
Yamamoto, Kiyoteru Tokyo, JP 2 5

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