Plating bath composition and method for electroless plating of palladium
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 12, 2017
Grant Date -
May 4, 2017
app pub date -
Apr 7, 2015
filing date -
Apr 10, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention relates to a plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous acidic plating bath according to the present invention comprises a source for palladium ions, a reducing agent, a nitrogenated complexing agent for palladium ions and a water-soluble stabilizing agent selected from the group consisting of aromatic compounds comprising at least two residues wherein at least one residue is a hydrophilic residue and at least one residue has a negative mesomeric effect. The plating bath has an increased stability against undesired decomposition while maintaining a sufficient plating rate.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2015 Application Filing Year
- C23C Class
- 3009 Applications Filed
- 2118 Patents Issued To-Date
- 70.39 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- C23C Class
- 27.20 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Mar 12, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 12, 2029 |
