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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TEIJIN LIMITED	2-4 NAKANOSHIMA 3-CHOME KITA-KU OSAKA-SHI OSAKA 5300005
TSUKISHIMA KIKAI CO LTD	TOKYO JAPAN

International Classification(s)

• C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
• C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
• B05D:PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Ekinaka, Tatsuya	Osaka, JP	12	65
Kishimoto, Hiroshi	Osaka, JP	80	781
Kon, Tatsuichirou	Osaka, JP	3	26
Morita, Yume	Osaka, JP	4	33
Nakagomi, Masato	Tokyo, JP	3	26
Ogata, Satoshi	Tokyo, JP	111	884
Suga, Takehiro	Osaka, JP	9	60

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Mar 12, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Mar 12, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 12, 2017	US,9758630,B2   US9758630B2	GRANTED PATENT AS SECOND PUBLICATION
April 20, 2017	US,20170107345,A1   US20170107345A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9758630

Polymer substrate with hard coat layer and manufacturing method for such polymer substrate

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