Encapsulated microelectromechanical structure

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United States of America Patent

PATENT NO 9758371
SERIAL NO

15242437

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Abstract

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A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.

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Patent Owner(s)

Patent OwnerAddress
SITIME CORPORATION5451 PATRICK HENRY DRIVE SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gupta, Pavan Belmont, US 39 282
Lutz, Markus Mountain View, US 165 3864
Partridge, Aaron Cupertino, US 151 2545

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