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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SUMITOMO BAKELITE CO LTD	5-8 HIGASHI-SHINAGAWA 2-CHOME SHINAGAWA-KU TOKYO 1400002 ?1400002

International Classification(s)

• C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
• B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
• C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Bell, Andrew	Brecksville, US	127	1282
Seto, Keitaro	Brecksville, US	19	39
Tsang, W C Peter	Brecksville, US	11	27
Zhen, Hongshi	Brecksville, US	4	12

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Mar 12, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Mar 12, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 12, 2017	US,9757818,B2   US9757818B2	GRANTED PATENT AS SECOND PUBLICATION
February 09, 2017	US,20170036308,A1   US20170036308A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9757818

Thermally decomposable polymer compositions for forming microelectronic assemblies

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