Manufacturing method for back drilling hole in PCB and PCB
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United States of America Patent
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-
Sep 5, 2017
Grant Date -
May 26, 2016
app pub date -
Nov 28, 2013
filing date -
Aug 2, 2013
priority date (Note) -
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Abstract
A method for manufacturing a back drilling hole in a printed circuit board (PCB) and PCB are provided. The method for manufacturing the back drilling hole comprises: forming a through hole in the PCB (1); forming a metal layer (12) with prescribed thickness on an inner wall of the through hole; filling resin in the through hole which has been formed with the metal layer (12); performing back drilling machining on the through hole which has been filled with the resin; removing metal scraps remained in the through hole. The manufacturing method protects the hole wall copper by filling the hole with the resin, so that acid corrosion process only removes the remained metal scraps after back drilling of the small hole, does not affect on the hole copper of the resin protecting portion.
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