Method of making a circuitized substrate
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United States of America Patent
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Sep 5, 2017
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N/A
app pub date -
Oct 4, 2011
filing date -
May 23, 2007
priority date (Note) -
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Abstract
A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.
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