Electronic device furnished with a conducting layer and method of fabrication
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United States of America Patent
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Sep 5, 2017
Issued Date -
N/A
app pub date -
Feb 22, 2016
filing date -
Aug 28, 2015
priority date (Note) -
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Abstract
An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.
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