Fingerprint identification module
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United States of America Patent
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Sep 5, 2017
Grant Date -
Jan 12, 2017
app pub date -
Dec 17, 2015
filing date -
Jul 9, 2015
priority date (Note) -
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Abstract
A fingerprint identification module including a cover plate, a fingerprint identification sensor, a first adhesive layer, and at least one light source is provided. The cover plate has an inner surface, an outer surface opposite to the inner surface, and a plurality of microstructures located at the inner surface. The fingerprint identification sensor is located under the microstructures and attached to the microstructures through the first adhesive layer. The at least one light source is located under the inner surface and adjacent to the fingerprint identification sensor.
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