Optical measurement of lead angle of groove in manufactured part
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United States of America Patent
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Sep 5, 2017
Grant Date -
Jan 26, 2017
app pub date -
Oct 8, 2016
filing date -
Oct 29, 2010
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Abstract
A portion of the surface of a cylindrical part with a machined groove is mapped with an optical profilometer during the manufacturing process and the height map is fitted to a virtual cylindrical configuration that best fits the data. Two-dimensional Fourier Transfer analysis of the map data is advantageously used to find the orientation of the groove on the part. The orientation of the groove is then compared to the longitudinal axis of such virtual cylinder to calculate the groove's lead angle. If the measured lead angle is outside a predetermined design tolerance deemed acceptable for manufacturing purposes, the part is removed from the fabrication line.
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