Multi-layer encapsulated structures
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United States of America Patent
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Sep 5, 2017
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app pub date -
Sep 4, 2013
filing date -
Apr 4, 1997
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Abstract
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
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