Plastics bonding systems and methods

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9752059
SERIAL NO

14678126

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Reactive composition includes a reactive component able to form an adhesive bond between two substrates, at least one of which comprises a plastic material. The substrate may include an initiator on or near the surface thereof. The initiator may be present in the plastic material inherently, by blending in an additive package, through injection molding, or other process. The reactive component may comprise a methylene malonate, a reactive multifunctional methylene, a methylene beta ketoester, a methylene beta diketone. A carrier component for the reactive component may be selected to interact with the plastic substrate to soften and/or penetrate the surface to be bonded. The surface of the plastic may be abraded or otherwise treated to expose the initiator. The reactive component, upon contact with a suitable initiator, is able to polymerize to form an interpenetrating polymer weld.

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Patent Owner(s)

Patent OwnerAddress
NIPPON SHOKUBAI CO LTDOSAKA-SHI OSAKA 541-0043

International Classification(s)

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  • 2015 Application Filing Year
  • C09J Class
  • 1204 Applications Filed
  • 830 Patents Issued To-Date
  • 68.94 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Desousa, Joseph D Cincinnati, US 15 83
Ellison, Matthew McBrayer Mason, US 4 155
Malofsky, Adam Gregg Loveland, US 17 342
Malofsky, Bernard Miles Bloomfield, US 17 386

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Patent Citation Ranking

  • 11 Citation Count
  • C09J Class
  • 95.51 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges57926101 - 1011 - 2031 - 4005101520253035404550556065707580859095100

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