Plastics bonding systems and methods
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Sep 5, 2017
Issued Date -
N/A
app pub date -
Apr 3, 2015
filing date -
Nov 16, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Reactive composition includes a reactive component able to form an adhesive bond between two substrates, at least one of which comprises a plastic material. The substrate may include an initiator on or near the surface thereof. The initiator may be present in the plastic material inherently, by blending in an additive package, through injection molding, or other process. The reactive component may comprise a methylene malonate, a reactive multifunctional methylene, a methylene beta ketoester, a methylene beta diketone. A carrier component for the reactive component may be selected to interact with the plastic substrate to soften and/or penetrate the surface to be bonded. The surface of the plastic may be abraded or otherwise treated to expose the initiator. The reactive component, upon contact with a suitable initiator, is able to polymerize to form an interpenetrating polymer weld.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
NIPPON SHOKUBAI CO LTD | OSAKA-SHI OSAKA 541-0043 |
International Classification(s)

- 2015 Application Filing Year
- C09J Class
- 1204 Applications Filed
- 830 Patents Issued To-Date
- 68.94 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Desousa, Joseph D | Cincinnati, US | 15 | 83 |
# of filed Patents : 15 Total Citations : 83 | |||
Ellison, Matthew McBrayer | Mason, US | 4 | 155 |
# of filed Patents : 4 Total Citations : 155 | |||
Malofsky, Adam Gregg | Loveland, US | 17 | 342 |
# of filed Patents : 17 Total Citations : 342 | |||
Malofsky, Bernard Miles | Bloomfield, US | 17 | 386 |
# of filed Patents : 17 Total Citations : 386 |
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Patent Citation Ranking
- 11 Citation Count
- C09J Class
- 95.51 % this patent is cited more than
- 8 Age
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