Device and method for processing wafers

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United States of America Patent

PATENT NO 9751698
SERIAL NO

13878570

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Abstract

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The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.

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Patent Owner(s)

Patent OwnerAddress
EV GROUP GMBHST FLORIAN AM INN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hangweier, Peter-Oliver Pram, AT 3 0
Lindner, Friedrich Paul Schärding, AT 45 91

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